EMC LIVE Wireless is a one-day, online event where industry experts come together for educational webinars, product updates, and current trends. With the everchanging world of Wireless/IoT/5G, EMC LIVE Wireless is your change to hear first-hand how you can come out ahead!
- Techniques for Mitigating Intrapair Skew-Induced EMI with Shielded Connectors
- SnapShot Board Level Shielding- Solving Many of Today’s EMI Shielding Challenges
- And More!
Global Industry Marketing Manager, I-PEX
PRODUCT DEMO: Techniques for Mitigating Intrapair Skew-Induced EMI with Shielded Connectors
10:00 – 10:30 am EDT
The mediums over which electrical signals travel can either help or hurt the electromagnetic compatibility (EMC) of a system. This presentation discusses how cable assemblies affect EMC, particularly the effect of intra-pair skew on radiated emissions, and how shielded connectors mitigate these E-fields.
Sales and Marketing, XGR Technologies
PRODUCT DEMO: SnapShot® Board Level Shielding – Solving Many of Today’s EMI Shielding Challenges
10:45 – 11:15 am EDT
This webinar will demonstrate how a novel use of solder spheres as an attachment mechanism for a unique board level EMI shield solves many of the short comings of traditional, board level shielding cans. Specifically, XGR’s solder sphere system enables unobstructed inspection and re-work, eliminates the need for co-planarity, and minimizes penalizing board real estate requirements. The result is an extremely rugged, space saving, and lightweight board level shielding solution for high density wireless applications.