EMC LIVE™
Wireless/IoT/5G 2022

The EMC landscape for consumer electronics has continued to expand in scope and severity over the years. Back in the 80s, the focus was on radiated emissions between systems, and the clock frequencies were in the sub-10 MHz region. Today, the discussion includes radiated and conducted emissions at the component level, intra-system compatibility (de-sense), multi-gigahertz clock speeds, and on-board radiating elements (antennas). In this presentation, we discuss several connector design features that I-PEX has implemented to boost interconnect EMC performance.

This webinar will demonstrate how a novel use of solder spheres as an attachment mechanism for a unique board level EMI shield solves many of the short comings of traditional, board level shielding cans. Specifically, XGR’s solder sphere system addresses the inability to inspect and re-work, poor co-planarity, and penalizing board real estate requirements. The result is an extremely rugged, space saving, and lightweight shielding solution for high density wireless applications.

5G is a broad term used to describe the next generation of wireless communications. Like previous generations of wireless (e.g. 3G, 4G, LTE), 5G supports the requirements of such previous generations, extends and enhances capabilities, and offers new, enabling features for various applications and markets. Whereas 3G and 4G standards have been developed with a key focus on significantly increasing the data rate, the 5G standard for sub-6GHz focuses on latency issues and massive connection challenges that appeared with the development of IoT.

This webinar will help participants understand the requirements for IoT & 5G antennas and how to choose the right antenna system for their products. Key questions to be answered in this webinar include: What are 5G and IoT? Why should IoT or 5G be considered instead of 4G? What are the key features to look for in an IoT or 5G antenna system during the product design in order to reduce time-to-market?

The potential for the Internet of Things to transform the industrial environment is far greater than in the home. The Industrial Internet of Things (IIoT) is the beginning of the next industrial revolution. Industrial automation forms an integral role in the modern production line. From simple motors to complex robots, many manufacturing processes take advantage of the latest technology to reduce the need for human input. This automation equipment has become even more important in the new smart factory.

Utilisation of correct connectors and protocols enables machines and factories to communicate and learn with ever-changing demands. These connectors need to offer superior performance, whether delivering power to energy-intensive processes or providing secure high-speed communications for intelligent automation equipment. At the same time, these connectors need to be robust and sealed, ready to resist the harsh environments found on today’s factory floor.

Learn how Bulgin’s product portfolio is helping to build smart factories.

High-temperature Operating Life Time (HTOL) testing applies stress to instigate thermal wear out. Precise control and monitoring of the stress conditions is vital to accurate results. We will discuss some of these variables especially as it relates to RF/Microwave components.